Module Development Engineer (Adv Packaging)

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About This Role

  • The Role and Impact This role is responsible for driving semiconductor technology development and manufacturing enablement for both high-volume manufacturing and next-generation technologies.
  • The successful candidate will develop process integration and equipment solutions, conduct feasibility studies, and support the development of innovative device architectures and manufacturing technologies.
  • Working closely with internal engineering teams and external suppliers, this individual will lead process development efforts, optimize manufacturing capabilities, and contribute to technology roadmaps that enable future product requirements.
  • This position requires regular onsite presence to support essential business and manufacturing activities.
  • Key Responsibilities Drive technology development and manufacturing enablement for current and future semiconductor technologies.
  • Develop process integration and equipment solutions to meet device performance, quality, and manufacturability requirements.
  • Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, metrology development, and system design.
  • Perform process technology feasibility studies using engineering analysis, simulations, and experimental methods.
  • Conduct pathfinding activities to support hardware and process development for emerging device architectures.
  • Develop technology roadmaps that support future manufacturing and product requirements.
  • Identify and implement process and equipment improvements to increase production efficiency, manufacturing capability, and overall output.
  • Collaborate with equipment and material suppliers to develop and implement enabling technologies.
  • Evaluate manufacturing trends, emerging technologies, and industry developments to identify opportunities for future process innovation.
  • Partner with cross-functional teams to support technology transfer, process qualification, and manufacturing ramp activities.
  • Behavioral Skills Strong technical problem-solving and analytical skills.
  • Ability to lead and influence cross-functional teams in a highly collaborative environment.
  • Effective verbal, written, and presentation communication skills.
  • Strong organizational skills with the ability to manage multiple priorities simultaneously.
  • Demonstrated ability to drive results in fast-paced and technically complex environments.
  • Ability to work independently while maintaining strong stakeholder alignment.
  • Adaptability and willingness to learn new technologies, processes, and methodologies.

Requirements

  • Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical discipline 1+ years of experience utilizing Statistical Process Control (SPC) and/or Design of Experiments (DOE) methodologies.

Nice to Have

  • 1+ years of experience in semiconductor technology development. 1+ years of experience delivering results for complex, time-sensitive technical projects. 1+ years of experience with semiconductor fabrication processes and manufacturing technologies.
  • Previous experience working in a semiconductor foundry or high-volume semiconductor manufacturing environment.

Benefits

  • We offer a total compensation package that ranks among the best in the industry.
  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel .
  • Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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Intel

US, Oregon, Hillsboro

Specialisation
Open roles at Intel
680 positions
Job ID
/job/US-Oregon-Hillsboro/Module-Development-Engineer--Adv-Packaging-_JR0284566

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