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About This Role
- As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor manufacturing and packaging technologies at Intel.
- Your work will focus on developing, and optimizing cutting-edge manufacturing metrology defect inspection tool and scaling high-volume production.
- From tool selection to process integration and equipment solutions, you will ensure robust and efficient processes that support Intel's leadership in innovation and advanced technology development.
- Collaborating with cross-functional teams and external partners, your contributions will directly impact Intel's ability to deliver industry-leading products.
- Business group You will be part of Intel's Advanced Packaging Technology Development organization, dedicated to crafting next-generation packaging solutions that support Intel's innovation and manufacturing objectives.
- This group drives advancements in semiconductor technology by enabling high-volume production of cutting-edge defect inspection tools.
- Your team will play a pivotal role in ensuring the successful integration of advanced technologies while contributing to Intel's broader vision of technological leadership.
- Key Responsibilities Lead the development of advanced manufacturing metrology defect inspection tool development, including new tool selection, automation optimization, equipment metrology development, and system integration.
- Drive process and hardware development of defect inspection tool to enable high-volume manufacturing and future technology innovations.
- Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.
- Partner with equipment and material suppliers to implement enabling process technologies and drive advancements.
- Optimize production efficiency, manufacturing techniques, and output for both new and existing tools.
- Leverage statistical process control and data analytics to enhance process stability and drive continuous improvement.
- Recommend and implement modifications to operational equipment to improve efficiency and scalability.
- Collaborate with cross-functional teams to ensure seamless process integration and alignment with project deliverables.
- Behavioral traits: Demonstrated success in leading programs from strategy formation through high-volume production and continuous improvement initiatives.
- Recognized technical leadership with a proven ability to solve complex engineering challenges and drive innovative solutions.
- Strong collaboration skills across functional areas like yield, operations, and supplier management.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
- Minimum Qualifications Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM field with 6+ years of semiconductor experience OR Master's degree in the same fields with 4+ years of semiconductor experience OR PhD in the same fields with 2+ years of semiconductor experience. +2 years of experience in: Manufacturing process development, statistical process control, and process improvement methodologies.
- Hands-on experience in wafer-level assembly, semiconductor processing, or advanced packaging technology in developing defect inspection method.
Nice to Have
- Experience in metrology for advanced packaging technologies, such as hybrid bonded interconnects, ultra-fine pitch solder connections, or RDL-based packaging.
- Intel is searching for innovative engineers who are passionate about shaping the future of semiconductor technology.
- Bring your expertise, creativity, and dedication to our team and contribute to groundbreaking advancements in the industry.
- Apply today and become a pivotal part of Intel's mission to deliver world-changing technologies.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $155,520.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
666 positions
Job ID
/job/US-Oregon-Hillsboro/Module-Development-Defect-Metrology-Engineer_JR0287864
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