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About This Role
- Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
- Key Responsibilities Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting preparation, documentation and AR tracking, and quick and effective response to production issues.
- Be experts in all tools and processes in the area to support elaborate DOEs and NPIs.
- Be able to coach and role model the correct execution of module operations.
- Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
- Apply correctly and effectively the POR tools and methods to contain, mitigate and solve issues, including: XTREAMs and Spec RFCs, Wiki / Documented BKMs / MITTS records / Tool error and troubleshooting message, 5M+E checklists, Tool log files / SC logs / SPC++ / E3 / ATRMS / Feedback files, MBPS (is/is-not, models, validation data).
- Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations.
- Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution First point of contact for Manufacturing.
- Spend more than 3/4 of your time on the floor.
- Disposition/release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours.
- Support Manufacturing on resolving any product recipe or parameter issues.
- Keep all Operation and Recipe Creation specs up to date.
- Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams.
- Assume initial ownership where RC is not evident.
- Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation.
- Understand and ensure all data is collected on critical lots.
- Consolidate and prioritize area improvement projects with Manufacturing Support Working Group and Task Force activities, executing experiments and providing engineering data.
- Support MTEs on resolving any equipment issue.
- Complete clear pass downs for issues seen and resolutions found.
- Support early processing of lots through new operations, then provide training, certification and final endorsement to Manufacturing.
- The candidate should exhibit the following behavioral traits: Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment.
- Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.
Requirements
- Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience.
- Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience.
- Experience listed above should be in any the following: Semiconductor Equipment Development and/or Manufacturing Semiconductor Product Development and/or Manufacturing High Volume Technology Manufacturing Automated Manufacturing This position is not eligible for Intel Immigration Sponsorship Preferred Qualifications: - High Volume Manufacturing experience is a plus. - Engineering experience in Semiconductor Fab or Package Assembly is a plus.
- We invite you to bring your expertise, creativity, and passion for innovation to Intel, where you can make a meaningful impact on the future of technology.
- Apply today to join our team and help drive Intel's success in delivering world-class packaging solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
627 positions
Job ID
/job/US-Arizona-Phoenix/MEOS---Module-Engineer-On-Shift_JR0286270
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