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About This Role
- Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
- Module Engineers on Shift (MEOS) responsibilities include but are not limited to: - Prioritize and organize daily activities around multiple requests for engineering experiments , daily alignment meeting preparation, chairing , documentation and action tracking, and quick and effective response to production issues. - Be experts in all tools and processes in the area to support elaborate experiments and New Product Introductions . - Be able to coach and role model the correct execution of module operations. - Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams. - Apply correctly and effectively the standard tools and methods to contain, mitigate, and solve issues, including Response Flow Checklists; Wiki-sites; Best Known Methods; Issue and Pass down Systems of Record; Equipment and Process checklists; Tool and Station Controller error messages and log files; Process Control charts. trends and events; Recipe Management Systems; Structured Problem-solving tools and templates.
- Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations. - Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution - First point of contact for Manufacturing. - Spend more than 3/4 of your time on the production floor . - Disposition and release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours. - Support Manufacturing on resolving any product recipe or parameter issues. - Keep all Operation and Recipe Creation specs up to date. - Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams.
- Assume initial ownership where root cause is not evident. - Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation. - Understand and ensure all data is collected on critical lots. - Consolidate and prioritize area improvement projects with Manufacturing - Support Working Group and Task Force activities, executing experiments and providing engineering data. - Support Manufacturing Equipment Technicians on resolving any equipment issue. - Support early processing of lots through new operations, then provide training, certification, and final endorsement to Manufacturing.
- The candidate should exhibit the following behavioral traits: - Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment. - Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
- Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Requirements
- Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience.
- Master’s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience.
- Experience listed above should be in any the following: Semiconductor Equipment Development and/or Manufacturing Semiconductor Product Development and/or Manufacturing High Volume Technology Manufacturing Automated Manufacturing This position is not eligible for Intel Immigration Sponsorship Preferred Qualifications: - High Volume Manufacturing experience is a plus. - Engineering experience in Semiconductor Fab or Package Assembly is a plus.
- We invite you to bring your expertise, creativity, and passion for innovation to Intel, where you can make a meaningful impact on the future of technology.
- Apply today to join our team and help drive Intel's success in delivering world-class packaging solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-139,810.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
Open roles at Intel
759 positions
Job ID
/job/US-Arizona-Phoenix/MEOS---Module-Engineer-On-Shift_JR0283008
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