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About This Role
- At Intel, we create world-changing technology that improves the life of every person on the planet.
- By joining the Substrate Packaging Technology Development (SPTD) organization within our Advanced Packaging Team, you will support our mission to be the supplier of choice for leading-edge, affordable advanced substrate packaging solutions.
- This is your opportunity to lead a high-performing team that values technical excellence, continuous learning, and a collaborative, supportive work environment.
- We are seeking a Manufacturing Operations Manager Day Shift - Advanced Packaging to join our advanced packaging operations in Chandler, Arizona.
- In this role, you will lead and develop a team of highly skilled technicians responsible for equipment maintenance, troubleshooting, tool recovery, and daily factory execution.
- Working hands-on in our dynamic manufacturing facility, you will maintain a visible shift presence to strengthen team performance, optimize equipment stability, and directly support the strategic goals that enable Intel's continued packaging leadership.
- Shift Information: Shift 7 Shift Hours: 6:00 AM – 6:00 PM Schedule: (days backend) AM-PM Thurs-Sat and alternating Wednesday days Key Responsibilities: Shift Team Leadership: Lead, schedule, and develop a shift team of technical equipment technicians, managing daily workstation assignments, rotations, and performance standards.
- Maintenance & Resource Planning: Build and execute detailed resource plans for corrective and preventive maintenance activities to maximize equipment uptime and stability.
- Continuous Improvement Leadership: Own shift performance metrics (safety, quality, cost, and output) by driving continuous improvement initiatives using structured Lean, Six Sigma, or Model-Based Problem Solving (MBPS) methodologies.
- Training Program Execution: Establish, evaluate, and execute technical training plans to systematically upgrade technician skills aligned with manufacturing roadmap requirements.
- Cross-Functional Engineering Collaboration: Partner directly with Module Engineering groups to resolve systemic hardware faults, execute tooling improvements, and stabilize manufacturing processes.
- Operational Policy & Safety Enforcement: Enforce strict compliance with Intel safety guidelines, factory protocols, and operational policies on shift.
- As a Successful Candidate, You Will Bring: Dynamic Leadership & People Development: Natural talent for building, coaching, and motivating high-performing technical teams in a fast-paced environment.
- Structured Problem Solving: Passion for utilizing logical, data-driven methodologies to dissect complex manufacturing bottlenecks and equipment failures.
- Exceptional Communication: Clear, direct, and diplomatic verbal and written communication style to align priorities across shift handoffs and engineering teams.
- Strategic Executive Presence: Comfort managing critical, high-urgency factory excursions while maintaining structural standards and promoting corporate values.
- Apply today to join Intel Arizona's Substrate Packaging Technology Development team.
- Take command of cutting-edge shift operations, develop the next generation of technical talent, and build a rewarding career at the forefront of semiconductor innovation.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.
- This Position is not eligible for Intel immigration sponsorship.
Requirements
- A bachelor’s degree in a STEM field (Engineering preferred) with 3+ years of experience in a high-volume manufacturing or military technical environment or relevant experience.
- OR a master's degree in a STEM field with 2+ years of experience in a high-volume manufacturing or military technical environment or relevant experience.
- Relevant experience can be any of the following: Troubleshooting or supervising the repair of complex electromechanical, hydraulic, or pneumatic manufacturing equipment.
- Managing, writing, or executing technical training plans for industrial technician teams.
- Applying Lean Manufacturing and/or Six Sigma, and/or Model-Based Problem Solving (MBPS) to drive yield or tool stability improvements.
Nice to Have
- 2+ years of experience: Substrate, high-density interconnect, assembly, packaging, or silicon process manufacturing.
- Leading or supporting high-volume factory ramps or hardware qualifications.
- Direct experience managing people, schedules, and shift logs in a manufacturing or technical environment.
- Verifiable training in factory operations systems or factory physics.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $89,010.00-170,630.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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787 positions
Job ID
/job/US-Arizona-Phoenix/Manufacturing-Operations-Manager-Day-Shift---Advanced-Packaging_JR0288465
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