Failure analysis and TEM Engineer

About This Role

• Intel created HVM Global labs organization to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with the Technology Development (TD) team, and FSM fab managers.
• This job requisition is seeking a Transmission Electron Microscopy (TEM) Engineer working in our Israeli failure analysis laboratories.
• Selected candidate will work in a dynamic team supporting technology development and yield improvement.
• The TEM group uses the latest state-of-the-art workflows leveraging a high level of autonomy.
• TEM engineers may support conventional manual TEM.
• TEM Engineers Responsibilities Include (but Are Not Limited To) • Review incoming requests and determine appropriate TEM workflow strategy.
• Prepare plans as appropriate for TEM sample preparation team. • Hands on operation of laboratory equipment, such as TEM microscopes. • Interpretation of complex TEM results, translating to actionable data for FAB process and integration teams. • Support continual improvement and development of new workstreams and techniques. • Develop a thorough understanding of manual TEM operation lines. • Mentor TEM preparation technicians. • Candidate should have the following behavioral skills: • Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills. • Inquisitive, desire to learn and expand knowledge in field. • Ability to work with multi-functional, multi-cultural teams. • Strong in decision making and problem solving.
• This position requires to work weekends based on business needs.