Die Sort Module Engineer (Contract)

About This Role

• In this position, you will be responsible to improve the process and equipment performance of SDx Module in KMDSDP organization.
• The Role and Impact: - Drive module and equipment excellence by leading a continuous improvement for test equipment and module performance, focusing on New Product-Technology Introduction (NPI-NTI) to meet and exceed safety, quality, productivity, and cost targets for High-Volume Manufacturing (HVM).
• Support strategic HVM ramp and roadmap alignment by collaborate with technology development and partner factories to define critical process parameters for successful product ramps.
• Proactively manage capacity by aligning with the product roadmap, ordering collaterals, and qualifying tools.
• Guide a small team to support critical factory projects, including tool and equipment installations, while fostering a collaborative environment.
• Business Group - As part of Intel's Wafer Packaging Manufacturing group, you will join a globally recognized organization at the forefront of semiconductor packaging.
• We design, develop, and deliver innovative factory solutions to meet evolving technology needs.
• With a commitment to driving advancements in high-density modular assembly, computing, and connectivity, our group fosters a highly collaborative and innovation-driven environment to enable Intel's success in its core business areas.
• Key Responsibilities: - Provide hands-on support by troubleshooting process and equipment NPI/NTI/HVM escalations from Supervisor, Shift MT or ES.
• Focus on technical problem-solving and analysis by conducting detailed data analysis to resolve complex issues and ensuring tools are production-ready to support factory module NPI/NTI and HVM operations.
• Demonstrate strong experience in die/wafer sort, test programming, and debug methodologies.
• Work independently with minimal supervision, utilizing scripting or statistical tools to analyze data and drive decisions.