Die Prep Module Engineer (Contract Role)

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About This Role

  • The Role and Impact As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, capability, and stability of high-precision assembly equipment within our advanced Die Preparation factory.
  • In this role, you will leverage your deep technical expertise to address complex electro-mechanical challenges, optimize high-speed pick and place processes, and implement innovative solutions in a dynamic, high-volume manufacturing environment.
  • Your hands-on contributions will directly impact factory yield, equipment uptime, OEE, and process stability, playing a vital role in enabling Intel's packaging roadmap and supporting the delivery of next-generation, cutting-edge silicon technologies.
  • Business group As part of Intel Wafer Packaging Manufacturing group, you will join a globally recognized organization at the forefront of semiconductor packaging.
  • We design, develop, and deliver innovative factory solutions to meet evolving technology needs.
  • With a commitment to driving advancements in high-density modular assembly, computing, and connectivity, our group fosters a highly collaborative and innovation-driven environment to enable Intel's success in its core business areas.
  • Key Responsibilities Process Optimization - Own, stabilize, and optimize pick and place, PnP process parameters, drive systematic yield improvement, and resolve process integration issues.
  • Equipment Engineering - Lead complex troubleshooting, preventive/corrective maintenance strategies, and collaborate with tool vendors to upgrade hardware/software.
  • Data and Yield Analysis - Utilize Statistical Process Control, SPC, Design of Experiments, DOE, and Failure Mode and Effects Analysis, FMEA to identify root causes of process drift or hardware failures.
  • Cross-Functional Collaboration - Partner with upstream/downstream process owners and research and development teams to seamlessly transfer and ramp new products, NPI.
  • Documentation and Standards - Standardize operating procedures - SOPs, document troubleshooting guides, and present technical findings/progress updates directly to factory stakeholders.

Qualifications

  • Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering with minimum 2 years of work experience.
  • Fresh graduate is welcome to apply.
  • Good knowledge experience in semiconductor back-end assembly, specifically within Die Preparation and pick and place, PnP processes will be an added advantage.
  • Basic understanding of Statistical Process Control, SPC, statistical data analysis, and structured problem-solving methodologies.
  • Expertise in Design of Experiments, DOE, Failure Mode and Effects Analysis, FMEA, and Root Cause Analysis, RCA will be an added advantage.
  • Good communication skills with the ability to collaborate in cross-functional team environments and present technical data clearly.

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Intel

Malaysia, Kulim

Specialisation
Open roles at Intel
590 positions
Job ID
/job/Malaysia-Kulim/Die-Prep-Module-Engineer--Contract-Role-_JR0286815-1

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