Defect Review Technician

About This Role

• Be a part of Intel's Advanced Packaging Command Center (APCC), the global command center for advanced packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM).
• Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end-to-end operational execution across regions and delivering consistent, high-quality execution at scale.
• As the defect review technician, you will be instrumental in supporting global defect review activities, including defect classification, validation, and hold lot disposition.
• You will help maintain quality excellence while contributing to APCC's mission of delivering standardized, high-quality execution at scale.
• Your primary focus will be the accurate classification of defects captured by multiple inspection systems.
• Through precise defect classification, you will play a vital role in minimizing defect noise, driving systematic defect reduction initiatives, and maintaining the optimal balance between quality control and manufacturing efficiency.
• Key Responsibilities 1.
• Defect Classification and Analysis • Review and Analyze defect images captured by diverse metrology tools. • Accurately classify defects based on documented defect specification. • Distinguish between true defects requiring disposition action and false positives or nuisance defects. • Maintain proficiency across multiple inspection platforms and adapt classification criteria to different tool capabilities and imaging conditions 2.
• Defect Validation • Verify defect classifications against established criteria and specifications • Partner with Layer Owner to ensure consistent defect categorization approaches • Prevent over-rejection scenarios by accurately identifying non-critical defects and cosmetic variations that do not impact product performance. • Avoid under-rejection situations by ensuring killed defects are properly identified and flagged for disposition. 3.
• Hold Lot Disposition • Ensure strict compliance in review and disposition of hold lots based on documented Out-of-Control Action Plans (OCAP) • Ensure proper documentation and traceability of all disposition decisions. • Collaborate with Layer Owner to update and refine OCAP procedures based on emerging defect patterns 4.
• First Level Defect Analysis • Perform comprehensive first level defect analysis as the initial point of technical review for all flagged defects. • Document initial findings and recommendations to support Layer Owner analysis and decision-making processes.