Back End( BE) Process Integration Engineer

Requirements

• are required to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Requirements listed would be obtained through a combination of industry-relevant job experience, internship experiences, and or schoolwork/classes/research.
• Minimum Qualifications PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field of study.
• Hands-on cleanroom experience in one or more of the following: Interconnect process development (BEOL integration) Advanced interconnect metallization (Cu, Co, Ru, Mo, or emerging metals) Electrical characterization of interconnect stacks (RC, EM, reliability) Cleanroom process development in a university or industry fab environment Preferred Qualifications Deep understanding of RC delay, electromigration, TDDB, via resistance, and low-k dielectric integration JMP, Python (scripting/automation), SQL, MATLAB, JSL, TCL — used for real data analysis, not just familiarity Hands-on experience with dry etch, ALD, PECVD, CMP, metallization in a research or production fab Demonstrated ability to design experiments, analyze results, and drive process improvements.
• Strong analytical and presentation skills — ability to translate complex data into actionable engineering decisions Familiarity with automation and defect classification systems (e.g., KLA, Applied Materials review tools).
• Proven ability to influence outcomes across engineering disciplines without direct authority.
• Clear, concise written and verbal communication of complex technical issues to diverse audiences.
• Track record of driving projects to completion with accountability in ambiguous, fast-moving environments.