Advanced Packaging Technology Development Process Integration Engineer
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About This Role
- We are a global leader in semiconductor innovation, pushing the boundaries of silicon manufacturing and advanced packaging technology.
- Our Advanced Packaging Technology and Manufacturing (APTM) organization is at the forefront of next-generation chip solutions, delivering cutting-edge technologies that power the devices of tomorrow.
- With a culture built on collaboration, engineering excellence, and continuous innovation, we are committed to developing world-class talent and fostering an environment where bold ideas thrive.
- Our facility in New Mexico, United States serves as a critical hub for technology development and high-volume manufacturing excellence.
- We are seeking a talented and driven Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Albuquerque, New Mexico, United States .
- In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes.
- You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long-term packaging strategy.
- This is an exciting opportunity to make a meaningful impact at the intersection of process development and high-volume manufacturing.
- Key Responsibilities: Roadmap Enablement: Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives Cross-Functional Collaboration: Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions Defect & Yield Management: Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data-driven methodologies to identify root causes and implement sustainable corrective actions Process Development: Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development PRI Enablement & Transfer Readiness: Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high-volume manufacturing Value Engineering: Identify and implement cost-effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness Technology Transfer: Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post-transfer As a successful candidate, you must possess Collaborative Spirit — You thrive in team environments and naturally build strong working relationships across diverse groups and disciplines Effective Communication — You convey complex technical concepts clearly and confidently to both technical and non-technical audiences Adaptability — You remain composed and productive in a fast-paced, ever-evolving environment, embracing change as an opportunity Problem-Solving Mindset — You approach challenges with curiosity, creativity, and a structured, solutions-oriented attitude Ownership & Accountability — You take initiative, follow through on commitments, and hold yourself to a high standard of excellence Attention to Detail — You bring precision and thoroughness to your work, ensuring quality outcomes at every stage Innovative Thinking — You consistently look for smarter, better, and more efficient ways to achieve results Are you ready to shape the future of semiconductor manufacturing? Join our world-class team in New Mexico, United States , and be part of a mission-driven organization where your expertise will directly influence next-generation packaging technologies.
- We offer a competitive compensation package, comprehensive benefits, and a dynamic work environment that champions growth, innovation, and collaboration.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor's degree in Engineering, Material Science, Physics, or a related specialized field, with 3+ years of relevant experience; or a Master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience.
- Relevant experience for this position will be: Process integration, yield analysis, quality management or process development in high-volume manufacturing environments.
- Knowledge of semiconductor advanced packaging techniques and flows.
Nice to Have
- 3+ years of experience in value engineering and an innovative mindset to identify cost-effective solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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/job/US-New-Mexico-Albuquerque/Advanced-Packaging-Technology-Development-Process-Integration-Engineer_JR0285716
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