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About This Role
- The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities.
- Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures.
- By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry.
- Business group You will be part of Intel's Advanced Packaging Technology Development organization, a pioneering team that focuses on creating robust and scalable manufacturing processes to support Intel's innovation in semiconductor technology.
- This group is instrumental in enabling high-volume production while driving advancements in device performance and reliability, helping Intel achieve its broader goals of technological excellence and industry leadership.
- Key Responsibilities Develop and optimize advanced manufacturing processes, including material selection, equipment metrology, and system design.
- Conduct feasibility studies and simulations to meet device performance and reliability specifications.
- Drive process innovation and pathfinding activities to enable next-generation semiconductor architectures.
- Collaborate with equipment and material suppliers to design and implement innovative process technologies.
- Develop technology roadmaps to guide future manufacturing needs and set industry standards.
- Monitor production efficiency and recommend modifications to improve scalability and output.
- Utilize statistical process control and data analytics to ensure process stability and continuous improvement.
- Partner with cross-functional teams to align on process integration and project deliverables.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- Minimum Qualifications Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Chemistry, or related STEM field with 4+ years of relevant experience.
- OR PhD in the same fields with 2+ years of relevant experience. 2+ years of experience in semiconductor processing or advanced packaging technology development and process development methodologies, statistical process control or manufacturing process improvements.
- Preferred Qualifications Strong technical expertise in areas such as plasma etch, plating processes, or thin-film deposition.
- Experience in wafer-level assembly, hybrid bonded interconnects, or advanced packaging technologies.
- Demonstrated success in leading programs from strategy formation to high-volume production.
- Strong collaboration skills with cross-functional teams, including yield, operations, and supplier management.
- Ability to solve complex engineering challenges and drive innovative solutions that align with Intel's strategic goals.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
666 positions
Job ID
/job/US-Oregon-Hillsboro/Advanced-Packaging-TD-Plating-Module-Engineer_JR0287732
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