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About This Role
- The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers.
- As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
- In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand.
- This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
- A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful.
- Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.
- Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
- Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement.
- Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments.
- Drive continuous improvement initiatives to minimize defects and optimize process reliability.
- Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance.
- Collaborate with internal teams and external stakeholders to align process strategies with program goals.
- Behavioral traits Demonstrated expertise in structured problem solving and data-driven decision-making.
- Proven leadership in supplier management and technology enablement.
- Strong collaboration, influencing, and communication skills across global, cross-functional teams.
- Strategic mindset with the ability to align technical solutions with organizational objectives.
- Enthusiasm for innovation, mentoring, and contributing to Intel's technical leadership.
Requirements
- Bachelor's degree in engineering, physics, materials science, or a related field, with 9+ years of relevant experience; or Master's degree in engineering, physics, materials science, or a related field, with 6+ years of relevant experience; or PhD in engineering, physics, materials science, or a related field, with 4+ years of relevant experience.
- The experience listed above should be a combination of the following: Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
- Experience in advanced packaging, substrates, or semiconductor process development.
- Join us in shaping the future of manufacturing with your expertise and passion for technology development.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $164,100.00-231,670.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
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602 positions
Job ID
/job/US-Arizona-Phoenix/Advanced-Packaging-Substrate-Supplier-Enablement-Lead_JR0286186
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