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About This Role
- We are seeking a highly skilled and motivated Lithography Process Development Engineer to join our Advanced Packaging Technology Development team.
- In this role, you will be driving lithography process development at the forefront of next-generation semiconductor packaging technology, including hybrid bonding applications.
- You will work in a dynamic, cross-functional environment collaborating with process integration, equipment, metrology, and design teams to enable industry-leading interconnect density and yield.
- Key Responsibilities • Qualify scanner/stepper platforms and Track system for backend and hybrid bonding lithography applications • Develop, characterize, and optimize photolithography processes for back-end applications, including Cu damascene pad patterning, dielectric via and trench lithography, bonding interface layer patterning, and alignment mark / overlay target design and optimization • Evaluate and implement underlayer stacks to address topography challenges inherent in far backend and packaging substrates • Develop and optimize overlay metrology and control strategies critical for advanced packaging nodes • Implement advanced process control (APC) including run-to-run (R2R) and lot-to-lot overlay feedback/feedforward control loops • Work closely with integration and other modules to develop fully integrated process flows, ensuring lithography compatibility with upstream and downstream process steps • Support yield learning by performing systematic defect analysis, root cause investigation, and implementing corrective actions for lithography-related yield detractors • Contribute to technology roadmap planning for next-generation node and engage with equipment and material suppliers to evaluate next-generation tools and materials Qualifications: Minimum qualifications are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications - Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related fields with 3+ years of relevant experience - PhD degree in the same fields with 2+ years of relevant experience Experience listed above should be a combination of the following: - Hands-on lithography process development experience with i-line, KrF or ArF lithography process development in a semiconductor fab - Hands-on experience with photoresist process development, including coat/bake/develop optimization, resist profile engineering, and process window characterization - Strong understanding of optical lithography fundamentals: aerial image formation, resist chemistry, focus-exposure matrix (FEM), depth of focus (DOF), and exposure latitude (EL) - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Preferred Qualifications - Strong analytical and problem-solving skills with ability to perform systematic root cause analysis on complex, multi-variable process issues - Experience with packaging processes, equipment automation development, or project management in technology development. - Experience in advanced packaging lithography environments (Foveros, Foveros Direct, fan-out WLP, 2.5D/3D IC, CoWoS, SoIC, or equivalent) - Experience with overlay metrology and control, and familiarity with CDSEM and OCD/scatterometry for process monitoring and control We look forward to welcoming passionate and driven individuals who want to work on transformative projects and play a crucial role in shaping the future of semiconductor technology.
- Take this opportunity to bring your unique skills to Intel and make an impact-apply today.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
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627 positions
Job ID
/job/US-Oregon-Hillsboro/Advanced-Packaging-Photolithography-Development-Engineer_JR0286114
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