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About This Role
- Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration.
- Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect.
- As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures.
- In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.
- Key Responsibilities Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
- Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.
- Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc.
- Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.
- Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths.
- Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance.
- Present findings through technical presentations and potential publications.
- What You Will Gain : Gain hands-on exposure to advanced packaging integration challenges that enable future semiconductor technologies.
- Learn how process integration, material selection, design rules, metrology, and package architecture interact to drive yield and reliability.
- Develop practical experience with developing package simulation, model validation, and data-driven engineering analysis.
- Gain exposure to advanced packaging architectures, including chiplets, 2.5D/3D integration, wafer-level assembly, and industrial leading interconnect technologies.
- Participate in technical reviews, technology forums, and intern research presentations with experienced engineers and researchers.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
- Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
- Minimum Qualifications Candidate must be pursuing a PhD degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline Must be available to work full-time for the duration of a 3-month internship. 3+ months of academic or professional experience in one or more of the following areas: Experience with laboratory experimentation, engineering data analysis, or simulation/modeling workflows.
- Experience in process integration or hands-on module development.
- Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools.
- Statistical analysis, DOE, or machine learning for engineering applications.
- Preferred Qualifications 6+ months of academic or professional experience in one or more of the following areas: Advanced packaging, heterogeneous integration, wafer-level packaging, chiplet integration, or package assembly process development.
- Thermal/mechanical/electrical modeling, finite element analysis preferred.
- Failure analysis for semiconductor process and package assembly.
- Join us at Intel to contribute to technological advancements while building a rewarding and impactful career.
- Apply now to be a part of our extraordinary journey.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Our standard internship rates are based on your degree, location, and the job role.
- Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
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590 positions
Job ID
/job/US-Arizona-Phoenix/Advanced-Packaging-Integration-and-Simulation-Intern_JR0287009
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