Sr Assoc Eng Failure Analysis

What You'll Do

• A committed and self‑disciplined individual who can work night shift independently.
• Strong problem‑solving skills , with the ability to troubleshoot sample preparation challenges under time pressure.
• Perform Transmission Electron Microscopy (TEM) analysis and TEM sample preparation using Focused ion-beam (FIB) microscopy to support semiconductor failure analysis and characterization activities, able work in the night‑shift operations if required .
• Conduct pre‑FIB sample preparation , including but not limited to: Wafer cleaving Optical microscope inspection and defect navigation Sample coating Sample delayering using RIE/polishing Operate Focused Ion Beam (FIB) systems to perform precision milling, thinning, and lamella preparation for TEM analysis.
• Conduct TEM profiling and measurement by bright field and scanning mode imaging.
• EDX analysis on material element.
• Hands‑on experience and knowledge in TEM and FIB is preferred.
• Ensure samples meet quality, cleanliness, and thickness requirements to enable high‑quality TEM imaging.
• Support urgent and critical requests from fabrication and failure analysis teams, demonstrating a strong sense of urgency and ownership .
• Communicate effectively with engineers, peers, and shift counterparts to ensure smooth handover and continuity across shifts .
• Follow laboratory safety procedures, SOPs, and quality standards at all times.
• Actively participate in continuous improvement activities related to TEM sample preparation and night‑shift efficiency.