Principal Engineer Process Engineering

What You'll Do

• of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV ) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level),do troubleshooting for process and tool issues.
• Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.
• Job Responsibilities: Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.
• Startup and qualify new process and new equipment within scheduled timeline.
• Work closely with Equipment Engineer on new equipment acceptance and tool matching.
• Understand the concept of repeatability and reproducibility (R&R) run.
• Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.
• Use lean manufacturing and six sigma processes.
• To work closely with equipment team to improve equipment productivity indices Resolve complex technical issues in own Module or yield related issues.
• Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.
• Sustain and improve process / SPC to meet quality, cost, productivity requirements To coach and develop other engineers on advance packaging Etch processes knowledge.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity.
• Establish plans and strategies to optimize process capability to meet operational requirements Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs Related manufacturing and development experience is requested.
• Required Qualifications: BS degree or Master's Degree or PhD in Electrical Engineering, Chemical Engineering, Science, Solid State Physics or other relevant engineering physical science discipline is required Relevant working experience in Bonder (TEL W2W/ BESI D2W), die re-constitution & Annealing (TEL Alpha 303, mattson- helios) process tool.
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work effectively with different cultures.
• We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
• As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
• All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
• No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices.
• Candidates will not be charged any fees at any stage of the recruitment process.
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• All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels.
• To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at global.compliance@GlobalFoundries.com or visit our official website.
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• Please apply through the official GlobalFoundries careers site only.
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