Principal Engineer (CMP Module)

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About the Team

  • As a Principal Engineer focusing on Chemical Mechanical Planarization (CMP) , you will be a key technical leader in the Process Module team.
  • You will be responsible for developing, optimizing, and sustaining cutting-edge CMP processes critical to our semiconductor fabrication technology nodes.
  • This role requires deep, hands-on CMP technical expertise, a strategic mindset to drive advanced planarization solutions, and excellent communication skills to collaborate with cross-functional integration teams and external partners.
  • What you will do: Technical Expertise & CMP Process Development: Develop and modify CMP process formulations, methods, and tool controls to meet stringent quality standards.
  • Analyze, and review technical data and charts to ensure CMP performance, focusing on non-uniformity, defectivity, and removal rate stability.
  • Establish and maintain Standard Operating Procedures (SOPs) and Failure Mode and Effects Analysis (FMEA) specific to the CMP module.
  • Integrate CMP equipment capabilities and material systems to meet process module and technology specifications.
  • Lead recipe creation, maintenance, and optimization for CMP metrology tools (e.g., film thickness measurement, surface inspection) to ensure accurate process monitoring and improve recipe quality.
  • Leadership & Collaboration: Drive Continuous Improvement Plans (CIPs) to enhance process performance and productivity.
  • Lead and participate in cross-functional teams to achieve organizational goals.
  • Serve as a technical subject matter expert for CMP, providing guidance and training to junior CMP engineers.
  • Collaborate with vendors and other internal teams for benchmarking and cross-learning initiatives.
  • Demonstrate mastery in all aspects of the CMP technical discipline, with group-wide recognition as a senior member of a technical team.
  • Problem-Solving & Innovation: Solve complex, novel, and non-recurring technical problems.
  • Proactively identify and implement significant changes to existing processes and methods.
  • Contribute to intellectual property by being a contributing inventor on patents related to CMP technology.
  • Participate in and contribute to conference or journal publications.
  • Safety & Compliance: Perform all activities in a safe and responsible manner.
  • Support all Environmental, Health, Safety & Security requirements.
  • What you need: Master’s or Bachelor’s Degree in Electrical / Electronics / Mechanical / Chemical / Materials Science Engineering ore related field. 5 to 8 years of relevant experience in wafer fabrication industry, with a strong focus on CMP.
  • We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
  • As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
  • All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
  • Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia

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Open roles at GlobalFoundries
524 positions
Job ID
/job/Singapore/Principal-Engineer--Module---PI---Equipment-_JR-2503389

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