Photonics Product Engineering Lead

What You'll Do

• Lead validation of high-speed photonic integrated circuit (PIC) designs from individual device level through full optical system specifications, correlating first-silicon performance with product targets to drive product maturity and manufacturability.
• Develop and execute device- and system-level characterization and validation plans for photonic building blocks such as modulators, photodetectors, waveguides, light couplers, and CWDM/DWDM/BiDi multiplexers.
• Correlate wafer-, package-, and system-level performance, quantifying gaps between first-silicon results and product targets across 100G, 200G, and 400G per-lane architectures.
• Define test structures, design-of-experiments, and measurement methodologies to extract key optical, electrical, and RF parameters across process, voltage, and temperature conditions.
• Analyze link budgets, bandwidth, insertion loss, crosstalk, extinction ratio, BER, and power efficiency to assess design performance against Co-Packaged Optics (CPO) and pluggable optics requirements.
• Feed silicon learning back into design rules, device models, PDKs, and process targets by partnering closely with design, process, packaging, assembly, and test teams.
• Support new tape-out bring-up, wafer-level and module-level characterization, and establish correlation between simulation, first-silicon, and production measurements.
• Drive design-for-manufacturability and design-for-test improvements that enable robust yield, repeatable production test, and scalable ramp.
• Document validation results, spec correlation, and product-maturity assessments to support design reviews, qualification milestones, and production release gates.
• Required Qualifications : Bachelor’s, Master’s, or PhD in Electrical Engineering, Photonics, Optical Engineering, Physics, or a related technical discipline; advanced degree preferred.
• Experience in the design, characterization, or validation of silicon photonics or photonic integrated circuits (PICs) and high-speed optical devices.
• Strong understanding of high-speed optical device physics, including modulators, photodetectors, lasers, light couplers, and CWDM/DWDM/BiDi wavelength multiplexing.
• Hands-on experience with optical, electrical, and RF characterization equipment such as vector network analyzers, optical spectrum analyzers, BER testers, high-speed oscilloscopes, optical power/wavelength meters, and wafer probe stations.
• Working knowledge of link budget analysis, eye-diagram and BER evaluation, and PAM4 or coherent signaling for 100G, 200G, and 400G per-lane systems.
• Demonstrated ability to correlate first-silicon data with specifications and models, applying statistical data analysis to drive design and process improvements.
• Proficiency in test automation and data analysis using tools such as Python or MATLAB.
• Familiarity with design-for-manufacturability, design-for-test, and production ramp considerations for optical interconnect products.
• Strong cross-functional collaboration and communication skills, with the ability to present technical findings clearly to both technical and non-technical audiences.
• We Offer Base Salary Equity Annual Bonus Plan Medical Insurance Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/