NCG 3D Heterogeneous Integration Engineer-Cryogenic 3D packaging

Nice to Have

• Systems partitioning expertise for optimization of product form factor for performance, definition of interconnect strategy (Heterogeneous Integration, electrical D2D, broadband surface coupling, etc.) to guide technology development and partner selection (Corporations, Universities and/or Research Institutes).
• Design of electrical test structures for interconnects and packages.
• Project management skills - i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.
• Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/