MTS Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

What You'll Do

• of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues.
• Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.
• Job Responsibilities: Designing, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.
• Startup and qualify new process and new equipment within scheduled timeline.
• Work closely with Equipment Engineer on new equipment acceptance and tool matching.
• Understand the concept of repeatability and reproducibility (R&R) run.
• Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.
• Use lean manufacturing and six sigma processes.
• To work closely with equipment team to improve equipment productivity indices Resolve complex technical issues in own Module or yield related issues.
• Support the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.
• Sustain and improve process / SPC to meet quality, cost, productivity requirements To coach and develop other engineers on advance packaging Etch processes knowledge.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity.
• Establish plans and strategies to optimize process capability to meet operational requirements Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs Related manufacturing and development experience is requested.
• Required Qualifications: BS degree or Master's Degree or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or other relevant engineering discipline is required 4+ (PhD), 6+ (MSc), 8+ (BSc) years working experience in advanced packaging industry Required experience of Leading Fab wide cross modules process development and projects coordination.
• Hands-on experience in advanced packaging (Si interposer, D2W, W2W) process tools.
• Excellent verbal and written communication skills.
• Strong interpersonal skills and ability to work effectively with different cultures.
• Conduct regular meetings with PI & UMD for knowledge learning, with yearly projects that improve quality, cost, yield, or productivity.
• We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
• As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
• All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
• No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices.
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