Engineering WSDegree Intern – Process Engineering (Product)

What You'll Do

• Block 1: Foundational Learning & Exploration Learn semiconductor manufacturing fundamentals and wafer fabrication process flows Understand the role of product process engineering in high-volume manufacturing Learn cleanroom protocols, safety standards, and factory operations Gain exposure to product flows, specifications, and quality requirements Become familiar with MES, fab operations, and engineering systems Job shadow Product Process Engineers to understand day-to-day responsibilities Block 2: Product Process Analysis & Problem Solving Support analysis of product performance across manufacturing stages Study process parameters and their impact on product quality, yield, and reliability Perform data analysis to identify product-related trends, excursions, or improvement opportunities Apply statistical tools (e.g., SPC) to monitor and improve product stability Block 3 & Final Year Project (FYP): Engineer‑in‑Training Development Define FYP scope, objectives, and deliverables with an assigned mentor Execute an FYP focused on product or process improvement initiatives Conduct data analysis and, where applicable, DOE (Design of Experiments) to support product optimization Recommend improvements to enhance product performance, manufacturability, yield, or quality Participate in continuous improvement initiatives supporting cost, quality, or productivity Complete the FYP under the guidance of an assigned industrial mentor Skills & Experience Gained Technical Skills Understanding of product-focused process engineering in semiconductor manufacturing Knowledge of wafer fabrication, process variability, and product performance metrics Data analysis, SPC, and structured problem-solving skills Soft Skills Technical communication and presentation skills Collaboration across cross-functional teams (manufacturing, process, quality, yield) Exposure to AI and Machine Learning concepts applied to manufacturing or product data Practical Experience Hands-on experience in a high-volume semiconductor fab environment Project ownership within a product engineering context Networking opportunities, including exposure to engineering and manufacturing leadership Required Qualifications Enrolled in a Mechanical, Electrical, Electronics, Materials, or related Engineering degree Strong analytical and problem-solving skills Curious, detail-oriented, and eager to learn Strong time management, communication, and teamwork skills Positive mindset with an interest in manufacturing and product performance Additional Information This requisition is exclusively for students enrolled in the WSDegree Programme (2026 intake) Internship period must be clearly stated in the CV, resume, or cover letter Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia