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What You'll Do
- Support Test Development: Assist in developing, validating, and releasing electrical test methods for wafers, dies, interposers, package-level structures, and advanced packaging test vehicles.
- Execute Characterization: Conduct electrical characterization, engineering experiments, and data collection across process and product development lots under guidance from senior engineers.
- Test Hardware Support: Help define, qualify, and troubleshoot probe cards, sockets, load boards, interface hardware, cables, and related fixtures used for wafer-level and package-level testing.
- Data Analysis and Yield Learning: Analyze test results using statistical and visualization tools to identify trends, outliers, failure signatures, and yield-loss mechanisms.
- Summarize findings clearly for technical reviews.
- Failure Isolation: Support electrical fault isolation and coordinate with failure-analysis, integration, process, and reliability teams to determine potential root causes and verify corrective actions.
- Test Coverage and Correlation: Assist with test coverage reviews, guardband evaluation, repeatability and reproducibility studies, and correlation between bench, wafer-sort, final-test, and reliability data.
- Process and Product Qualification: Support development builds, qualification activities, reliability readouts, engineering change evaluations, and manufacturing readiness for new advanced packaging solutions.
- Continuous Improvement: Contribute to cycle-time reduction, test-time optimization, automation, data-quality improvement, and standardization of test methods and reports.
- Documentation: Maintain test plans, specifications, procedures, experiment records, data summaries, validation reports, and lessons learned in accordance with the team's document-control practices.
- Process Integration Support: Assist in developing and maintaining integrated process flows for advanced packaging structures from incoming wafer or die through assembly, test, and qualification.
- Module Coordination: Work with unit-process owners on lithography, deposition, plating, etch, CMP, wafer thinning, temporary bonding and debonding, dicing, die bonding, underfill, molding, and thermal processing, as applicable to the assigned technology.
- Cross-Functional Collaboration: Work effectively with local and global engineering teams, suppliers, and manufacturing partners; communicate progress, risks, and technical observations in a timely manner.
- Safety, Quality, and Compliance: Follow applicable environmental, health, safety, cleanroom, laboratory, quality, document-control, and information-security requirements.
- Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Required Qualifications: Education – Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Microelectronics, Applied Physics, Materials Science, Mechanical Engineering, or a related technical field.
- Basic understanding of semiconductor devices, electrical measurements, circuits, and data interpretation.
- Working knowledge of common laboratory instruments such as digital multimeters, oscilloscopes, source-measure units, power supplies, or parameter analyzers.
- Ability to analyze structured datasets using Excel or a technical analysis environment such as Python, JMP, or MATLAB.
- Strong problem-solving skills, attention to detail, and willingness to learn unfamiliar technologies and tools.
- Strong written and verbal communication skills and the ability to work effectively in a cross-functional team.
Nice to Have
- Prior related internship or co-op experience Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
- Exposure to automated test equipment (ATE), wafer probing, package final test, bench characterization, or test-program development.
- Understanding of statistics, design of experiments (DOE), measurement-system analysis, statistical process control, or semiconductor yield concepts.
- Awareness of advanced packaging technologies such as 2.5D/3D integration, TSVs, interposers, micro-bumps, hybrid bonding, high-bandwidth memory, or system-in-package.
- Exposure to signal integrity, power integrity, thermal effects, mechanical stress, or reliability considerations in package and test design.
- We believe having a multicultural workplace enhances productivity, efficiency, and innovation whilst our employees feel truly respected, valued and heard.
- As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
- All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
- No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices.
- Candidates will not be charged any fees at any stage of the recruitment process.
- Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately.
- All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels.
- To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at global.compliance@GlobalFoundries.com or visit our official website.
- The Ethics & Compliance mailbox is not a recruitment channel.
- CVs/resumes submitted to this mailbox will not be reviewed, processed, or considered for employment opportunities.
- Please apply through the official GlobalFoundries careers site only.
- Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
Sourced directly from GlobalFoundries’s career page
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Specialisation
Open roles at GlobalFoundries
808 positions
Job ID
/job/SGP---Woodlands/Engineer-Packaging-Test-Engineering_JR-2604738
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