Advanced Packaging Engineer

What You'll Do

• The Advanced Packaging Engineer will lead the design, development, and integration of innovative co-packaged optics solutions, bridging the gap between Silicon Photonics (SiPh) PICs (Photonic Integrated Circuits) and high-speed electrical ASICs.
• This role demands hands-on expertise in 2.5D/3D heterogeneous integration, fiber-to-chip coupling, and thermal/mechanical optimization to deliver production-ready next-generation optical engines.
• Package Architecture & Design: Define 2.5D/3D integration strategies for co-packaging, including TSV (Through-Silicon Via), RDL (Redistribution Layer), and hybrid bonding for SiPh chiplet integration.
• Optical Coupling Solutions Development: Collaborate with cross functional teams on the design and assembly of fiber-to-chip coupling solutions to achieve low-loss optical interconnects.
• Process Integration: Develop and optimize packaging assembly flows (die-to-wafer/wafer-to-wafer) to ensure manufacturability (DfM) and reliability (DfR).
• Multiphysics Simulation: Perform thermal, mechanical (warpage), and opto-electronic simulations to validate designs.
• Root Cause Analysis: Perform failure analysis (FA) on high-speed electro-optical packages.
• Required Qualifications : Education: Master's or PhD in Electrical Engineering, Materials Science, Applied Physics, or related field.
• Experience: 10+ years of experience in semiconductor packaging (2.5D/3D) with a specific focus on photonic or optoelectronic packaging.
• Software Proficiency: Familiarity with EDA tools (e.g., Cadence, Ansys for thermal / mechanical simulations), and scripting languages (Python) for test automation.
• Yield & Reliability: Experience with DOE (Design of Experiments), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis) We Offer Base Salary Equity Annual Bonus Plan Medical Insurance Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/