Software Engineering Intern

Overview

• At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
• Responsible for designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software.
• Works on extremely complex problems where analysis of situations or data requires an evaluation of intangible variance factors.
• Position Requirements: The candidate should be attending a BS, MS or PhD program in ME/EE/CS, have strong programming skills in C++, and deep familiarity with object-oriented programming methods.
• Prior knowledge and experience with distributed/multi-threaded programming, numerical analysis techniques, meshing techniques, finite-element based thermal simulation, CFD analysis, and in-depth understanding of electric cooling of PCB/package/chip preferred.
• Experience on automatic design optimization for thermal targets is a plus.
• We’re doing work that matters.
• Help us solve what others can’t.