Principal Design Engineer

What You'll Do

• Architect, design, and deliver high‑speed analog / mixed‑signal circuits for Die‑to‑Die and chiplet‑based systems, including UCIe‑compliant interfaces.
• Own analog blocks for high‑speed interfaces such as clocking, TX/RX front‑ends, termination schemes, biasing, and equalization support circuits.
• Drive architecture definition , feasibility analysis, and design trade‑offs considering signal integrity, power, noise, and packaging parasitics.
• Perform schematic design, simulation, and optimization across PVT corners using industry‑standard EDA tools.
• Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to co‑optimize circuit and package design.
• Support layout reviews , parasitic extraction analysis, and post‑layout sign‑off for high‑speed performance.
• Collaborate with AMS verification , digital, and system teams to enable full‑chip integration and validation.
• Participate in silicon bring‑up, debug, and characterization , including correlation with simulation results.
• Contribute to design methodology, checklists, and best practices for high‑speed analog and D2D designs.
• Required Qualifications Bachelor’s or Master’s degree in Electrical / Electronics Engineering or related field. 8+ years of hands‑on experience in analog / mixed‑signal IC design .
• Strong experience with high‑speed interface design (e.g., DDR, PCIe, SerDes, Die‑to‑Die links).
• Solid understanding of UCIe standard concepts , D2D PHY requirements, and chiplet architectures.
• Experience working with advanced packaging technologies and understanding package‑induced effects on high‑speed signaling.
• Proficiency in schematic‑level design, simulation, and debug across PVT corners.
• Strong fundamentals in analog circuit theory , signal integrity, noise analysis, and clocking.
• Preferred / Nice‑to‑Have Skills Direct hands‑on experience with UCIe PHY design or integration .
• Exposure to AMS verification flows and mixed‑signal simulation environments.
• Experience with post‑silicon debug and correlation.
• Knowledge of power integrity, thermal considerations , and package‑aware design flows.
• Ability to mentor junior engineers and lead technical discussions.
• What Success Looks Like Robust, scalable UCIe / D2D analog IPs meeting performance, power, and reliability targets.
• Smooth collaboration across design, verification, and packaging teams.
• Predictable execution aligned with project milestones and KPIs / OKRs .
• Strong ownership mindset from architecture to silicon .
• We’re doing work that matters.
• Help us solve what others can’t.