Lead Product Engineer

What You'll Do

• This opportunity is for a Principal Product Engineer in the Digital and Signoff Group (DSG) at Cadence.
• The Cadence Digital and Signoff Group will offer you a dynamic environment in which you will work with innovative R&D and Customer Engagement teams to influence the development of software tools for advanced chip design platforms.
• Experience and Technical Skills required: Strong knowledge of IC design and physical design flow.
• Experienced in using EDA tools such as Cadence Innovus, Cadence Genus, Cadence Cerebrus with strong debug skills Good understanding of physical design constraints such as power, clock, placement, routing and timing.
• Proficient in scripting languages such as Tcl, Perl, or Python.
• Ability to work with cross-functional teams, including physical design, Synthesis, and signoff.
• Excellent communication and interpersonal skills.
• Ability to work under tight deadlines and handle multiple projects simultaneously.
• Testing, validating, and deploying Innovus software for key customer.
• Working with Research and Development (R&D) to discuss results and next steps for Innovus' features Qualifications BE/BTech/ME/MS/MTech or equivalent We’re doing work that matters.
• Help us solve what others can’t.