Advanced Package and 3DIC Solutions Director

What You'll Do

• may be added to this role as our 3DIC services team is staffed up.
• The candidate is expected to be an expert in Allegro Package Designer (APD, with experience routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bondwires, bumps and 3D structures and designs.
• Experience using Allegro SKILL for scripting and automation a plus.
• Experience with creating Virtuoso-ready APD package files a must.
• Expertise in 3rd party packaging formats, including GDS, Gerber, IPC and DXF, both for import and export.
• RF and standard based (PCIe, LPDDR, UCIE) routing experience a big plus.
• Position requires: Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering Minimum 20 years experience with package design 10 years experience as an APD expert Strong knowledge of advanced packaging concepts Strong knowledge of 2.5D, 3DIC and stacked die technologies Understanding of chip level CMOS design concepts desired Good programming knowledge with Allegro Skill and Ravel a plus Strong customer-facing communication and problem-solving skills Strong personal drive for continuous learning and expanding professional skill sets Excellent verbal and written communication skills The annual salary range for California is $157,500 to $292,500.
• You may also be eligible to receive incentive compensation: bonus, equity, and benefits.
• Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure.
• Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location.
• Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.
• We’re doing work that matters.
• Help us solve what others can’t.