Substrate Engineer

About This Role

• Responsible for working with Broadcom substrate subcontractors to manage and resolve issue relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
• Responsible for NPI activities, risk assessment, process improvement and development and production engineering support of high volume IC substrate manufacturing.
• Wok with Broadcom internal cross functional engineering team resolves issues with interactive nature, work on newly developed packaging technology and drive towards high volume manufacturing maturity.
• Responsible for new product pre-production engineering activities and drive improvement in process and visual mechanical yields, cycle time\ Take on site standardization in Best Known Methods, and verification on compliance toward Broadcom requirement.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.