Silicon Design and Validation Engineer

About This Role

• Broadcom is looking for a Silicon Design and Validation Engineer.
• In this highly visible role, you will perform design, verification and validation of analog and mixed-signal high-speed building blocks.
• You will collaborate with cross functional teams to launch ASIC products for data center networking.
• Qualifications include: M.Sc. or PhD. in Electrical Engineering or Computer Engineering with 6+ years of experience in analog and mixed signal IP design, verification and validation for high-speed data converters, SerDes and data center networking and optical I/O.
• Experience with design, validation and verification of analog front-end circuits, Trans-Impedance Amplifiers(TIA), PLLs, VCOs and clocking circuitry.
• Knowledge of development methodologies, design flows including EDA integration, foundry PDK and associated collaterals.
• Experience with bench test debug and validation of clock generation and timing IPs, data converters, TIAs, modulator drivers, clock and data recovery (CDR) and SerDes.
• Validation, verification and characterization of various control loops such as PLLs, LDOs.
• Deep understanding of signal integrity and power integrity for high-speed designs and experience with PI and SI measurements for correlation and debugging purposes.
• Experience in test development, debug, and reporting.
• Ability to work with Matlab or Python.
• Experience in assessing design bugs and recommending workarounds.
• Experience with measurement equipment such as DCO, oversampling/real time scopes, and network analyzers.
• Experience with RF and high speed probing is a plus.
• System level knowledge and deep understanding of current generation and next generation of optical and electrical high-speed I/Os Understanding of high-speed optical and electrical interconnect architectures and IEEE standards.
• Strong analytical thinking and problem-solving skills with excellent attention to details.
• It is a plus if the candidate has a good understanding of advanced packaging (2.5D / 3D) architectures.
• Highly Desired Qualifications: Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.
• Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.
• Excellent time and task management, and interpersonal skills.
• Willingness to travel when required.
• Additional Job Description: Compensation and Benefits The annual base salary range for this position is $120,000 - $192,000 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
• All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.