Senior Signal Integrity Engineer

About This Role

• About the Role We are looking for a Senior SI/PI Engineer to join our hardware engineering team.
• In this role, you’ll own the signal and power integrity analysis for our high-speed boards, packages, and system architectures.
• You will work directly with hardware, ASIC, SERDES, packaging, and layout engineers from early architecture trade-offs all the way through lab bring-up and characterization.
• If you enjoy building accurate 3D simulation models, developing optimized solutions, and validating designs in lab, this role is for you.
• What You’ll Do Modeling & Simulation: Build 2.5D/3D EM models for high-speed channels, package substrates, connectors, and PCB stackups.
• Perform time- and frequency-domain simulations for high-speed serial links (SerDes) and parallel interfaces (DDR/HBM).
• PDN Analysis: Assist in AC/DC power delivery network simulations to evaluate impedance targets, transient noise, and IR drop across boards and packages.
• Design Optimization: Provide clear layout constraints, stackup recommendations, and routing rules to hardware and layout teams.
• Optimize custom package designs, connector breakouts, and practical via designs.
• Iterate as bottlenecks are discovered.
• Lab Characterization: Validate simulations in the lab using VNAs, TDRs, BERTs, and real-time oscilloscopes.
• Correlate measurement data back to your models to refine future design rules.
• Debug & Bring-up: Partner with hardware teams during board bring-up to debug SI/PI issues and root-cause signal degradation or power noise.
• Automation: Leverage scripts (Python, TCL) to automate simulation flows, data processing, and design checks.
• What We’re Looking For Degree: BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
• Experience: 12+ years of practical experience in high-speed digital design, signal integrity, and power integrity.
• Fundamentals: Solid understanding of transmission line theory, S-parameters, crosstalk, jitter, EMI/EMC, and PDN concepts.
• Simulation Tools: Hands-on proficiency with tools like Ansys HFSS/SiWave, Cadence Sigrity/Allegro, Keysight ADS, or HSPICE.
• Interfaces: Direct experience simulating and analyzing high-speed interfaces (e.g., PCIe, 56G/112G/224G SerDes, DDR4/5, or HBM).
• Lab Skills: Comfortable operating high-frequency test equipment (VNAs, TDRs, high-bandwidth scopes), probing techniques, and performing model-to-hardware correlation.
• Nice to Have Familiarity with high-speed PCB laminates, stackups, via designs, and manufacturing trade-offs.
• Experience writing Python or TCL scripts to automate EDA tools.
• Compensation and Benefits The annual base salary range for this position is USD 143,800.00 To USD 230,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
• All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.