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About This Role
- Responsible for the design and implementation of packaging processes for new isolation products.
- Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
- Conduct Design of Experiments (DOE) and optimize newly developed processes.
- Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
- Perform process yield analysis and failure investigations for new device-related issues.
- Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.
- Requirement: We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
- Strong background in Mechanical Engineering and semiconductor packaging process development.
- Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
- Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.
- Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
- Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.
- Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
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Specialisation
Open roles at Broadcom
326 positions
Job ID
/job/Singapore-Yishun/R-D-Process-Engineer_R026160
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