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About This Role
- The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations.
- Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies.
- Typically possesses a graduate degree in electrical engineering and has several years of experience in the field.
About This Role
- Compensation and Benefits The annual base salary range for this position is $163,800 - $262,000 .
- As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
- All subject to relevant plan documents and award agreements.
- Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
- The company follows all applicable laws for Paid Family Leave and other leaves of absence.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Sourced directly from Broadcom’s career page
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Specialisation
Open roles at Broadcom
424 positions
Job ID
/job/USA-CA-San-Jose-Innovation-Drive/R-D-Engineer_R026018
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