R&D Engineer IC Design

About This Role

• We are part of the core switching group (CSG) at Broadcom developing industry leading network switches for enterprise and mega scale data centers .
• We are looking for experienced engineers to design cutting edge CoWos 2.5D , 3D interposer designs.
• You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design , routing and physical verification and tapeout to the foundries.
• As part of your job you will be interacting with packaging , signal integrity and foundries to meet the packaging, SI and physical requirements of the interposers.
• Experience with interposer designs including CoWoS, 2.5D/3D integration using Cadence Innovus/Integrity or Synopsys 3DIC compiler is a must.
• Candidates should have a strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies.
• Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip finishing are required to handle multiple Interposer designs in parallel.
• Basic understanding of routing structure impact on high-speed signal integrity (SI), power integrity (PI), and thermal analysis is required.
• Technical Skills & Experience: Experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies.
• Basic understanding of high-speed signal integrity (SI), power integrity (PI), and thermal analysis.
• Familiarity with semiconductor fabrication processes, particularly for silicon interposers.
• Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization.
• Ability to work with cross-functional teams including IC design engineers, packaging egineers, and foundries Additional Skills: Strong problem-solving skills and attention to detail.
• Excellent communication and teamwork skills.
• Ability to document design processes, specifications, and reviews.
• Familiarity with 3DBlox interposer modelling language is a plus Preferred Qualifications: Hands-on experience with high-density interposers in complex packaging environments.
• Strong scripting skills to automate the interposer design flow Previous experience at semiconductor or advanced packaging companies.
• Educational Background: Bachelor’s in Electrical Engineering, Microelectronics, or related fields and 8+ years of related experience, or a Master’s degree and 6+ years of related experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $120,000 - $192,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.