Packaging Architect Design Engineer

About This Role

• Hiring a talent in advanced packaging design with intensive hands-on experience in GDSII-based physical layout and in-depth knowledge in advanced 2.5D/3D packaging architect and technology.
• Skills in .mcm-based layout is a plus.
• The job scope includes: (1) Architect advanced packaging solution to meet future product requirements (2) Define design rules for the new technology (3) Design (with physical layout) test vehicles to support technology development (4) Generation of design collaterals for new technology introduction (5) Drive design-for-yield and design-for-cost activities after a new technology is in production Education/Experience Bachelor's degree in Engineering and 5+ years of related experience or Masters degree in Engineering and 3+ years of related experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $91,000 - $146,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.