Mechanical Engineer

About This Role

• We are seeking a highly motivated Mechanical Engineer with expertise in system enclosure design and liquid cooling infrastructure to join our dynamic team at Broadcom’s CSG (Compute and Switching Group).
• The successful candidate will play a key role in the full hardware development cycle, from concept through NPI production, with a focus on high-power system enclosure design, system bring-up, and validation.
• CSG develops advanced system-on-chip (SoC) devices for a wide variety of market segments.
• Our team designs reference and validation systems that enable customers to meet critical constraints in space, thermal management, manufacturability, and scalability.
• This is an exciting opportunity to help shape next-generation switch platforms and influence datacenter infrastructure at scale.
• Responsibilities Lead thermo-mechanical lab operations, including liquid cooling infrastructure, BGA socket thermal validation, and system-level testing.
• Own thermo-mechanical system component validation and troubleshooting, driving solutions from concept through production.
• Develop and qualify advanced thermal solutions (heatsinks, vapor chambers, liquid cooling, manifolds) through vendor collaboration.
• Conduct system-level thermal tests and correlate results with simulations.
• Define and execute thermal test plans, including documentation and data reporting.
• Design rack-mount enclosures and system components based on production requirements, collaborating with cross-functional teams (EE, thermal, compliance, manufacturing).
• Manage vendor relationships for thermal solution components (heatsinks, manifolds, fans, cooling hardware).
• Troubleshoot and resolve system-level thermal issues in high-power prototypes.
• Qualifications Bachelor’s degree in Mechanical Engineering or related field; 8+ years of experience in enclosure design and thermal test validation.
• Proficiency in PTC Creo and Windchill PLM (required).
• Strong background in heatsinks, heat pipes, vapor chambers, and liquid cooling systems.
• Hands-on experience with thermal measurement technologies, sensors, and lab instrumentation.
• Knowledge of datacenter rack standards (EIA-310, OCP).
• Familiarity with EMI/EMC shielding and compliance design considerations.
• Exposure to compliance and reliability testing (NEBS, shock/vibration, thermal cycling).
• Experience working with global contract manufacturers and suppliers to bring products from prototype to volume production.
• Experience with high-speed cabling design and routing (OSFP copper, optical, and internal cables, etc.), including bend-radius management, cable retention features, and serviceability within dense rack enclosures.
• Compensation and Benefits The annual base salary range for this position is USD 121,900.00 To USD 195,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
• All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.