IC Package Thermal Mechanical Engineer

About This Role

• IC Package Thermal Mechanical Engineer About the Role This role focuses on the mechanical design and thermo-mechanical simulation of complex, advanced semiconductor packages used in high-performance computing (HPC), AI, and networking products.
• As an IC Package Engineer, you will leverage advanced multiphysics simulations to optimize reliability, ensure high product yield, and resolve manufacturing challenges from early product definition through New Product Introduction (NPI).
• This position offers a dynamic balance: 70% advanced simulation and modeling work, and 30% hands-on lab experiments in reliability testing (e.g., Electromigration, Temperature Cycling [TCT], and drop tests).
• Key Responsibilities Advanced Simulation & Modeling (70%): Develop, perform, and validate advanced numerical Finite Element Analysis (FEA) and multiphysics models to evaluate package stress, strain, deformation, warpage, thermal cycling, and delamination.
• Physics-Driven Design: Apply an in-depth understanding of structural mechanics, fluids, and heat transfer to solve complex chip-package and package-board interaction challenges.
• Workflow Automation: Streamline simulation workflows by developing reusable model-generation, post-processing, design-of-experiments (DOE), and reliability-data-analysis tools (Ansys APDL, Python, or MATLAB).
• Leverage Machine Learning, Generative AI, and numerical tools to build automated user interfaces.
• Empirical Reliability Lab Work (30%): Conduct and oversee hands-on reliability lab testing to investigate package failure mechanisms and utilize experimental data to define and predict overall product reliability.
• Minimum Qualifications Education & Experience: Bachelor's degree with 8+ years of relevant industry experience; OR a Master's degree with 6+ years; OR a PhD with 3+ years of experience in Mechanical Engineering, Material Sciences, or a related field with an emphasis on solid mechanics.
• Core Engineering Knowledge: Deep understanding of electronic packaging structures and advanced materials.
• Ability to evaluate complex numerical simulations against first principles (e.g., strength of materials solutions).
• Working knowledge of electromigration and general silicon/IC packaging reliability.
• FEA Proficiency: Hands-on expertise with major Finite Element Method (FEM) tools, specifically ANSYS (Classic/Mechanical).
• Programming & Scripting: Strong capability in Ansys APDL, MATLAB, and Python.
• Preferred Qualifications Electromigration Reliability Experience: Experience supporting electromigration assessments by developing accelerated testing for package-level interconnects (including BGA balls, C4 bumps, Cu pillars, microbumps, and metallization structures), and partnering with failure-analysis teams to identify root causes of degradation.
• Material Characterization: Hands-on experience performing mechanical testing and utilizing experimental material characterization metrologies (e.g., DMA/TMA, nano-indentation).
• Thermal Analysis: Previous thermal engineering background utilizing tools such as Icepak and Flotherm.
• Advanced Tech: Experience integrating Machine Learning and Gen-AI applications into engineering workflows is highly desired.
• Compensation and Benefits The annual base salary range for this position is USD 109,700.00 To USD 175,500.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
• All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.