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About This Role
- Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs.
- You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.
- You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc).
- Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages.
- You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc..
About This Role
- Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400.
- This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
- Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
- The company follows all applicable laws for Paid Family Leave and other leaves of absence.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Tools & Skills
EDA Tools
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Job ID
/job/USA-Colorado-Fort-Collins-4380-Ziegler-Road/IC-Package-Mechanical-FEA-Engineer--R-D-_R024441-2
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