Die-to-Die (D2D) Applications Engineer

Nice to Have

• Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or other high-speed SerDes/PHY IP Experience with silicon bring-up, lab debug equipment (oscilloscopes, logic analyzers, protocol analyzers), and characterization Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug) Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role What Success Looks Like: Customers (internal and external) view you as a trusted, responsive technical resource for D2D PHY integration and debug Simulation and bring-up issues are triaged quickly and routed to root cause efficiently, whether the issue lives in RTL, firmware, or system integration Internal DFT/ATE teams get the PHY-specific support they need to develop robust test coverage Recurring issues are captured and turned into documentation that reduces future support burden Compensation and Benefits The annual base salary range for this position is USD 91,100.00 To USD 146,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth.
• All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.