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About This Role
- – You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
- You will work closely with package design & technology, test & product engg , production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
- Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams .
- Plan, drive & implement improvement activities for continual improvement, 2 nd sourcing, cost reduction & customer satisfaction .
Qualifications
- – PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes. – Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc. – Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM.
- Good analytical, problem-solving skills.
- Flexible and agile. – Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment. – Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice. – Experienced AutoCAD user.
- We will also consider qualified applicants with arrest and conviction records consistent with local law.
- If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Sourced directly from Broadcom’s career page
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Specialisation
Open roles at Broadcom
398 positions
Job ID
/job/Singapore-Yishun/Assembly-Process----NPI-Engineer_R024837
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