Advanced Packaging Development Engineer

About This Role

• Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips.
• We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.
• Key job scope includes - packaging technology roadmap future product needs for 3-5 years - support development of key components (HBM, iVR, Si Cap) for advanced packaging - manage reliability test to qualify new technology - lead yield improvement activities for new technology ramp-up The job requires intensive experience in related area - such as 2.5D/3D and HBM technology development and reliability/yield improvements.
• Project management and team work skills are required.
• Strength in technology innovation, development, and enablement are key factors to consider.
• A M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree) is required.
• Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.
• We will also consider qualified applicants with arrest and conviction records consistent with local law.
• If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.