Staff Semi Packaging Engineer

About This Role

• Advanced package platform development: drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package.
• IC package design: design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.
• Power module design: design and optimize power modules for performance, manufacturing, and reliability.
• Package design rule: define, maintain, and advance package design rules for emerging package platforms and power modules.
• Assembly subcontractor/OSAT management: work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities.
• Late afternoon/early evening conference calls are expected.
• Cross functional team collaborations: work closely with internal reliability team, business units, and supply chain management team to provide package engineering support.
• Project management: plan and drive for on time delivery of package development projects.
• Minimum Qualifications Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or Mechanical Engineering is required with at least 3 years of industrial working experience in related fields.
• PhD. degree is preferred.
• In-depth knowledge and experience in analog IC package and module design, optimization, and manufacturing.
• Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
• Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
• Package model and drawing creation: solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
• Package process development: experienced in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).
• Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.
• For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S.
• Department of Commerce - Bureau of Industry and Security and/or the U.S.
• Department of State - Directorate of Defense Trade Controls.
• As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
• We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
• EEO is the Law: Notice of Applicant Rights Under the Law .
• Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/Days The expected wage range for a new hire into this position is $130,168 to $188,490.
• Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.