Sr Manager, Product & Test Engineering - Power Modules

What You'll Do

• Product Engineering & NPI Execution Own end-to-end product engineering execution for advanced power modules from NPI through high-volume production and sustaining.
• Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
• Define and maintain product specifications, test limits, and guard-bands based on silicon behavior and manufacturing capability.
• Drive corner lot planning including characterization and qualification testing.
• Drive wafer acceptance test (WAT) to final test specification alignment.
• Own manufacturing release, qualification execution, and product change management (PCNs).
• Drive design for test (DFT) and design for manufacturability (DFM), and quality improvement through PPM reduction.
• Module Test Engineering & ATE Strategy Drive adoption of advanced test methodologies including adaptive testing, multi-site test optimization, and data-driven outlier screening to improve quality and reduce cost.
• Manage relationships with test equipment vendors and subcontract test operations at OSAT partners; own test floor readiness and capacity alignment for production ramps.
• Define Design-for-Test (DFT) requirements during the design phase; ensure adequate test access, built-in self-test (BIST) coverage, and production testability for new designs.
• Lead test yield improvement programs through statistical analysis — test limit optimization, guard-banding, GRR studies, Cpk monitoring, and STDF data analytics.
• Establish bench-to-ATE correlation methodology and standards for precision analog measurements: DC parametrics, AC response, gain/offset, noise, PSRR, leakage, timing, and power efficiency.
• Drive test hardware design standards for load boards, probe cards, and device interface boards; ensure signal integrity, power integrity, and measurement accuracy across all test interfaces.
• Oversee test program development and maintenance — automated test software (C/C++, Python), test coverage optimization, and test time reduction initiatives.
• Define and execute the test strategy for power module product lines across Si, SiC, and GaN technologies — spanning wafer sort, module-level final test, and system-level validation.
• Manufacturing & Assembly Ownership Own the manufacturability of advanced power modules, driving robust assembly processes across contract manufacturers (CM).
• Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies).
• Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production.
• Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.
• Work with assembly team to drive the packaging roadmap for current and next-generation module platforms, including advanced packaging technologies (fan-out, embedded die, flip-chip).
• Coordinate with supply chain team on capacity planning, technology qualification, and supply chain readiness.
• Qualification, Reliability & Compliance Work with Reliability team to define, execute, and oversee comprehensive qualification and reliability test plans aligned with IPC-9592 / IPC-9592B for power conversion devices.
• Execute and oversee reliability tests including: HTRB, HTGB, HAST, Temperature Cycling, Power Cycling, Thermal Shock, Vibration, Mechanical Shock, HTS/LTS, Life testing, and Burn-in.
• Conduct HALT (Highly Accelerated Life Testing) and HASS (Highly Accelerated Stress Screening) per IPC-9592A guidelines; establish operational and destruct limits for power modules.
• Apply Design for Reliability practices including MTBF analysis, derating, FMEA, corrosion analysis, and moisture sensitivity assessment.
• Ensure compliance with automotive standards and AEC-Q qualifications where applicable.
• Validate that all products meet customer, regulatory, and internal reliability requirements prior to production release.
• Customer & Market Engagement Serve as the senior technical interface for strategic customers on product, quality, manufacturing, and roadmap topics.
• Own successful execution of assigned customer programs — align internal timelines with customer expectations and proactively identify and mitigate risks.
• Lead technical escalations for production issues, customer returns, and corrective actions.
• Conduct regular program reviews with internal and customer stakeholders; provide data-driven status updates on schedule, quality, and risks.
• Establish execution dashboards and performance metrics for customer-facing program management.
• Support design-in activities, product qualification at customer sites, and on-site technical consultations.
• Team Leadership & Development Build, manage, and develop a team of product engineers — including hiring, onboarding, mentoring, and performance management.
• Establish product & test engineering standards for product readiness, manufacturability, and quality across the team.
• Drive workforce planning to scale the product engineering function in alignment with business growth.
• Foster a culture of technical excellence, data-driven decision-making, and continuous improvement.
• Mentor and grow next-generation technical leaders within the organization.
• Data-Driven Execution & Continuous Improvement Lead yield analysis, parametric trend monitoring, and root-cause investigations across the module portfolio.
• Drive cost, yield, and cycle-time improvement through data-driven analysis and systematic problem-solving.
• Leverage hands-on experience with FA laboratories, Design of Experiments (DOE), and material/process characterization.
• Establish and maintain KPIs and dashboards for product engineering performance, quality, and delivery.
• Champion continuous improvement initiatives across the product engineering function.
• Required Qualifications Education Bachelor's degree required in Electrical Engineering, Computer Engineering, Electronics Engineering, Materials Science, Microelectronics, or a related field.
• Master's degree strongly preferred in a relevant engineering discipline.
• Mechanical Engineering background is a plus, particularly for roles involving module packaging, thermomechanical analysis, and assembly optimization.
• Experience 10+ years of progressive experience in semiconductor product engineering, manufacturing engineering or test engineering — with demonstrated end-to-end ownership from NPI through high-volume production. 5+ years in a leadership role managing engineers or cross-functional technical teams.
• Strong technical depth in semiconductor power products (IGBT, MOSFET, SiC, GaN) and advanced power module design, assembly, and manufacturing.
• Demonstrated expertise in module product & test engineering, qualification, reliability testing, failure analysis, and assembly/packaging development.
• Proven track record of defining and executing product roadmaps, driving new product introductions, and managing product lifecycle.
• In-depth knowledge of IPC-9592 / IPC-9592B qualification, reliability, and manufacturing conformance requirements.
• Experience with automotive standards and AEC-Q qualification processes.
• Hands-on experience interfacing with CM partners and managing manufacturing transfers across global sites.
• Technical Skills Deep understanding of thermal, electro-thermal, and mechanical fatigue failure mechanisms in power modules.
• Working knowledge of advanced packaging technologies (fan-out, embedded die, flip-chip) and module assembly methods.
• Proficiency in both front-end and back-end semiconductor manufacturing processes.
• Advanced proficiency in data analysis tools including JMP, Minitab, Python, and Excel.
• Proficiency in reliability statistical methods (Weibull analysis, DOE, FMEA).
• Understanding of DC/DC converter architectures and power delivery systems.
• Working knowledge of ATE platforms (Teradyne Eagle/ETS, Advantest V93000) and test program architecture — sufficient to provide technical direction and review test engineering output.
• Familiarity with test hardware design: load board schematics, probe card specifications, and hi