Senior Engineer, Failure Analysis

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and Duties include but not limited to: Perform detailed physical, electrical, and material analysis on defective integrated circuits.
Utilize advanced FA techniques including but not limited to: X-Ray, CSAM, Curve tracing, Fault Isolation (FI), microprobe, nanoprobe, SEM/EDX, TEM, FIB, delayering and sample preparation/modification.
Analyze customer returns, qualification lots, yield issues, and NPI samples.
Localize defects, identify failure mechanisms, and provide clear root cause conclusions.
Prepare accurate, concise FA reports for internal teams and customers.
Work closely with product, process, test, design, and reliability engineering teams to verify hypotheses and support fast issue containment.
Support NPI ramp, reliability qualification, and yield improvement programs.
Optimize FA workflow, establish SOPs, and implement best practices.
Evaluate new equipment and technologies for the FA lab.
Support equipment evaluations and lab capability expansion initiatives.
Ensure FA documentation complies with internal quality systems (ISO/IATF standards).
Support audits and customer technical requests as needed.
Meet ADI's failure analysis cycle time and quality commitments.
Mentor junior engineers and technicians, sharing best practices and technical expertise.

Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Materials Science, Physics, Semiconductor Engineering, or related fields. 5–8+ years of hands-on experience in semiconductor IC failure analysis or related roles.
Strong knowledge of semiconductor device physics, IC packaging, wafer fabrication, and common failure mechanisms (ESD, EOS, EM, process-induced defects).
Strong technical understanding of Analog, Digital and Mixed-signal circuit analysis and layout.
Ability to perform comprehensive FA workflows for semiconductor devices from initial non-destructive to advanced destructive methods.
Proficiency with several FA tools: SEM/EDX, TEM, FIB, Fault Isolations (ELITE, iPhemos), microprobe, nanoprobe or relevant tools.
Familiar with decapsulation, wet/dry etching, de-processing, and the ability to work with chemicals for Physical FA.
Ability to interpret ATE data, yield patterns, schematics, and test results.
Excellent English communication and technical writing skills.
Ability to lead projects and work independently with minimal supervision.
Strong collaboration mindset across global, multicultural engineering teams.
Good time management and prioritization capabilities under tight timelines.
Good troubleshooting skills.

Fab and/or assembly process experience.
Knowledge of SPC, DOE, and statistical analysis tools (JMP, Minitab, Python).
Experience in 8D, FMEA, or Six Sigma methodologies.
Patent, publication, or technical conference presentation experience.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S.
Department of Commerce - Bureau of Industry and Security and/or the U.S.
Department of State - Directorate of Defense Trade Controls.
As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: 1st Shift/Days

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