Engineer, Process Development Engineering

Overview

• About Analog Devices Analog Devices, Inc.
• (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge.
• ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world.
• With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™.
• Learn more at www.analog.com and on LinkedIn and Twitter (X).
• Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
• Provide process engineering support for production lines, including troubleshooting yield and quality issues.
• Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
• Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
• Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
• Establish and maintain process documentation, specifications, and control plans.
• Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
• Analyze failure modes and reliability concerns related to die attach and flip chip processes.
• Interface with equipment vendors and material suppliers to qualify new technologies and improvements.
• Ensure compliance with quality standards and manufacturing best practices.
• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 3–10 years of experience in semiconductor packaging or assembly manufacturing.
• Hands-on experience with Die Attach and Flip Chip processes in a production environment.
• Strong knowledge of: a.
• Die bonding techniques b.
• Underfill processes d.
• Solder bump / micro-bump technology e.
• Familiarity with advanced packaging technologies is an advantage (e.g., WLCSP, BGA, SiP, 2.5D/3D packaging).
• Strong problem-solving and cross-functional communication skills.
• Experience with die attach equipment (ASM, BESI, Datacon, etc.).
• Familiarity with reliability testing and failure analysis.
• For positions requiring access to technical data, Analog Devices, Inc.
• may have to obtain export licensing approval from the U.S.
• Department of Commerce - Bureau of Industry and Security and/or the U.S.
• Department of State - Directorate of Defense Trade Controls.
• As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C.
• 1324b(a)(3) – may have to go through an export licensing review process.
• We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
• Job Req Type: Experienced Required Travel: Yes, 10% of the time Shift Type: Normal Time (Philippines).