Digital Design (Physical) Engineer

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What You'll Do

  • Physical Implementation: Contribute to the RTL-to-GDSII flow — floorplanning, power planning, placement, clock tree synthesis (CTS), and routing — with guidance from senior engineers Static Timing Analysis: Run STA across PVT corners in multi-corner multi-mode (MCMM) setups and help resolve setup/hold violations with the design and layout teams Power Integrity: Support power delivery network (PDN) work, including IR-drop and electromigration (EM) analysis Physical Verification: Run DRC, LVS, antenna, and ERC checks and drive issues to clean signoff Mixed-Signal Integration: Work with analog layout engineers on floorplan co-optimization and constraints at sensitive analog/digital boundaries DFT: Support scan chain stitching and ATPG pattern generation Flow and Automation: Script and automate repetitive physical design tasks to improve the team's flow Silicon Support: Support silicon bring-up and debug, correlating physical design decisions with lab measurements Requirements / Must Have Skills Digital Design Fundamentals: Solid understanding of digital logic, CMOS basics, and the IC design flow Timing Concepts: Working understanding of static timing analysis, setup/hold, and clock domain crossing (CDC) EDA Exposure: Coursework, internship, or tape-out project experience with digital implementation tools (Cadence Genus/Innovus/Tempus or an equivalent flow) Scripting: Ability to write Tcl, Python, or shell scripts to automate repetitive tasks Engineering Rigor: Careful, methodical approach to closure — able to track many small violations to zero without losing any Teamwork and English: Strong collaboration with design and layout teams, and sufficient English for daily communication and technical documents Preferred Education and Experience Master's degree in Electrical Engineering, Computer Engineering, Microelectronics, or a related field Tape-out experience from a university project or internship is a strong plus Exposure to power analysis (IR-drop, EM) or power intent specification (UPF/CPF) is a plus Exposure to DFT methodologies (scan insertion, compression, ATPG, JTAG/boundary scan) is a plus Familiarity with both mature analog process nodes (e.g., 180nm BCD) and advanced digital nodes is a plus Experience using AI tools to improve flow development or engineering productivity is a plus For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S.
  • Department of Commerce - Bureau of Industry and Security and/or the U.S.
  • Department of State - Directorate of Defense Trade Controls.
  • As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
  • We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
  • Job Req Type: Graduate Job Required Travel: No

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Analog Devices

China, Beijing, Haidian, Xixiaokou

Specialisation
Salary range
₹5-12 LPA to ₹40-70 LPA
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852 positions
Job ID
/job/China-Beijing-Haidian-Xixiaokou/Digital-Design--Physical--Engineer_R266468-1

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